1. Model-S is used to pry the CPU IC hard disk.
2. Model-E is used to remove glue from the IC CPU of the mobile phone motherboard.
3. Model-X professional edge glue removal tool.
4. Model-Y cuts the black glue without damaging the board.
5. Anti-slip and labor-saving design, ergonomic, comfortable grip.
Specification:
|
Package Weight
|
| One Package Weight |
0.05kgs / 0.12lb
|
| One Package Size |
21cm * 10cm * 2cm / 8.27inch * 3.94inch * 0.79inch
|
| Carton Weight |
7.00kgs / 15.43lb
|
| Carton Size |
44cm * 42cm * 32cm / 17.32inch * 16.54inch * 12.6inch
|
| Loading Container |
20GP: 450 cartons * 120 pcs = 54000 pcs
40HQ: 1046 cartons * 120 pcs = 125520 pcs
|
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