1. Selection of high-quality materials, no rust, high toughness, and corrosion resistance.
2. The surface adopts vacuum plating process, which will not fade.
3. Laser high-precision cutting, neat edges without burrs, uniform shape.
4. The blade is polished by hand, carefully polished by the first-line maintenance master, and directly used without polishing.
5. Ma1.0 can be used to pry IC and CPU glue removal.
6. Ma2.0 is a corner knife, which can be used to scrape the glue around the IC.
7. Ma3.0 is a special-shaped rubber tapping knife, which can cut vinyl without damaging the board.
Specification:
|
Package Weight
|
| One Package Weight |
0.01kgs / 0.03lb
|
| One Package Size |
8cm * 4cm * 4cm / 3.15inch * 1.57inch * 1.57inch
|
| Carton Weight |
6.00kgs / 13.23lb
|
| Carton Size |
42cm * 42cm * 42cm / 16.54inch * 16.54inch * 16.54inch
|
| Loading Container |
20GP: 359 cartons * 500 pcs = 179500 pcs
40HQ: 835 cartons * 500 pcs = 417500 pcs
|
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