1. Used to locate and relocate mobile phone PCB BGA parts
2. Convenient and quick re-bombardment of BGA without causing any damage, suitable for iPhone 11/11 Pro / 11 Pro Max BGA repositioning and repair to provide solutions
3. Unique hole design makes it easier to take out the formed solder balls
4. Fast and convenient soldering
5. Size: about 13x9x1.7cm
Specification:
|
General
|
| Compatible with |
Apple:
iPhone 11 Pro
, iPhone 11 Pro Max
, iPhone 11
|
|
|
Package Weight
|
| One Package Weight |
0.32kgs / 0.70lb
|
| One Package Size |
14.5cm * 10.2cm * 3cm / 5.71inch * 4.02inch * 1.18inch
|
| Carton Weight |
25.80kgs / 56.88lb
|
| Carton Size |
43cm * 32cm * 31cm / 16.93inch * 12.6inch * 12.2inch
|
| Loading Container |
20GP: 625 cartons * 80 pcs = 50000 pcs
40HQ: 1451 cartons * 80 pcs = 116080 pcs
|
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