1. Middle frame reballing platform, precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge
2. To show the beauty of design in a compact shape, motherboard reballing without worry is compact and easy, saving space
3. Magnet sliding dislocation design, smart application of the sliding dislocation design, easy to take
4. CNC high-precision integrated processing, stable positioning for the motherboard, no deviation in reballing
5. Strong magnetic attraction, accurate positioning no offset, and encountering high-temperature magnetism will not weaken
6. High-temperature magnetic strong pressing prevents the stencils from bulging caused by high-temperature
Specification:
|
General
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| Compatible with |
Apple:
iPhone 15 Pro Max
, iPhone 15 Pro
, iPhone 15
, iPhone 15 Plus
|
|
|
Package Weight
|
| One Package Weight |
0.20kgs / 0.45lb
|
| One Package Size |
11cm * 8cm * 2cm / 4.33inch * 3.15inch * 0.79inch
|
| Carton Weight |
25.00kgs / 55.12lb
|
| Carton Size |
35cm * 34cm * 22cm / 13.78inch * 13.39inch * 8.66inch
|
| Loading Container |
20GP: 1018 cartons * 120 pcs = 122160 pcs
40HQ: 2364 cartons * 120 pcs = 283680 pcs
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